Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

Bibliographic Details
Main Author:	Michaelides, Stylianos
Published:	Georgia Institute of Technology 2007
Subjects:	Integrated circuits Reliability Integrated circuits Design and construction Electronic packaging Reliability Electronic packaging Design
Online Access:	http://hdl.handle.net/1853/16028

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