Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

Bibliographic Details
Main Author: Michaelides, Stylianos
Published: Georgia Institute of Technology 2007
Subjects:
Integrated circuits Reliability
Integrated circuits Design and construction
Electronic packaging Reliability
Electronic packaging Design
Online Access:http://hdl.handle.net/1853/16028

Internet

http://hdl.handle.net/1853/16028

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