Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

Bibliographic Details
Main Author: Michaelides, Stylianos
Published: Georgia Institute of Technology 2007
Subjects:
Integrated circuits Reliability
Integrated circuits Design and construction
Electronic packaging Reliability
Electronic packaging Design
Online Access:http://hdl.handle.net/1853/16028
id ndltd-GATECH-oai-smartech.gatech.edu-1853-16028
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spelling ndltd-GATECH-oai-smartech.gatech.edu-1853-160282013-12-15T03:34:59ZPhysics-based process modeling, reliability prediction, and design guidelines for flip-chip devicesMichaelides, StylianosIntegrated circuits ReliabilityIntegrated circuits Design and constructionElectronic packaging ReliabilityElectronic packaging DesignGeorgia Institute of Technology2007-08-03T11:33:12Z2007-08-03T11:33:12Z1999-08Dissertationhttp://hdl.handle.net/1853/16028503426Access restricted to authorized Georgia Tech users only.
collection NDLTD
sources NDLTD
topic Integrated circuits Reliability
Integrated circuits Design and construction
Electronic packaging Reliability
Electronic packaging Design
spellingShingle Integrated circuits Reliability
Integrated circuits Design and construction
Electronic packaging Reliability
Electronic packaging Design
Michaelides, Stylianos
Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices
author Michaelides, Stylianos
author_facet Michaelides, Stylianos
author_sort Michaelides, Stylianos
title Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices
title_short Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices
title_full Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices
title_fullStr Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices
title_full_unstemmed Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices
title_sort physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices
publisher Georgia Institute of Technology
publishDate 2007
url http://hdl.handle.net/1853/16028
work_keys_str_mv AT michaelidesstylianos physicsbasedprocessmodelingreliabilitypredictionanddesignguidelinesforflipchipdevices
_version_ 1716618004925513728

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