Thermomechanical characterization of materials formicrominiaturized system board requirements

Thermomechanical characterization of materials formicrominiaturized system board requirements

Bibliographic Details
Main Author: Bansal, Shubhra
Published: Georgia Institute of Technology 2007
Subjects:
Printed circuits Materials
Materials Thermomechanical properties
Microelectronic packaging
Online Access:http://hdl.handle.net/1853/14825
id ndltd-GATECH-oai-smartech.gatech.edu-1853-14825
record_format oai_dc
spelling ndltd-GATECH-oai-smartech.gatech.edu-1853-148252013-12-15T03:34:04ZThermomechanical characterization of materials formicrominiaturized system board requirementsBansal, ShubhraPrinted circuits MaterialsMaterials Thermomechanical propertiesMicroelectronic packagingGeorgia Institute of Technology2007-06-22T11:33:45Z2007-06-22T11:33:45Z2003-08Thesishttp://hdl.handle.net/1853/14825675156Access restricted to authorized Georgia Tech users only.
collection NDLTD
sources NDLTD
topic Printed circuits Materials
Materials Thermomechanical properties
Microelectronic packaging
spellingShingle Printed circuits Materials
Materials Thermomechanical properties
Microelectronic packaging
Bansal, Shubhra
Thermomechanical characterization of materials formicrominiaturized system board requirements
author Bansal, Shubhra
author_facet Bansal, Shubhra
author_sort Bansal, Shubhra
title Thermomechanical characterization of materials formicrominiaturized system board requirements
title_short Thermomechanical characterization of materials formicrominiaturized system board requirements
title_full Thermomechanical characterization of materials formicrominiaturized system board requirements
title_fullStr Thermomechanical characterization of materials formicrominiaturized system board requirements
title_full_unstemmed Thermomechanical characterization of materials formicrominiaturized system board requirements
title_sort thermomechanical characterization of materials formicrominiaturized system board requirements
publisher Georgia Institute of Technology
publishDate 2007
url http://hdl.handle.net/1853/14825
work_keys_str_mv AT bansalshubhra thermomechanicalcharacterizationofmaterialsformicrominiaturizedsystemboardrequirements
_version_ 1716617761176682496

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