Thermomechanical characterization of materials formicrominiaturized system board requirements

Thermomechanical characterization of materials formicrominiaturized system board requirements

Bibliographic Details
Main Author: Bansal, Shubhra
Published: Georgia Institute of Technology 2007
Subjects:
Printed circuits Materials
Materials Thermomechanical properties
Microelectronic packaging
Online Access:http://hdl.handle.net/1853/14825

Internet

http://hdl.handle.net/1853/14825

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