Modeling of integrated circuit interconnect dielectric reliability based on the physical design characteristics
The objective of the research is to model the reliability and breakdown mechanism of back-end dielectrics in integrated circuits and to investigate the impact of physical design characteristics on the back-end dielectric reliability. As design and process complexities continue to increase, the relia...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2007
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| Online Access: | http://hdl.handle.net/1853/14137 |