Probe Modules for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects

Probe Modules for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects

The use of optical input/output (I/O) interconnects, in addition to electrical I/Os, is a promising approach for achieving high-bandwidth, chip-to-board communications required for future high-performance gigascale chip-based systems. While numerous efforts are underway to investigate the integratio...

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Bibliographic Details
Main Author: Thacker, Hiren Dilipkumar
Format: Others
Language:en_US
Published: Georgia Institute of Technology 2006
Subjects:
Optoelectronic testing
Optical testing
MEMS
Waveguide
MOEMS
Compliant leads
Optical interconnects
Packaging
Interconnects
Through-wafer interconnects
Optical loopback
Probe
Probes (Electronic instruments) Testing
High performance computing Research
Interconnects (Integrated circuit technology)
Microelectromechanical systems
Optoelectronic devices
Online Access:http://hdl.handle.net/1853/11597

Internet

http://hdl.handle.net/1853/11597

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