Fluorocarbon Post-Etch Residue Removal Using Radical Anion Chemistry
During fabrication of integrated circuits, fluorocarbon plasma etching is used to pattern dielectric layers. As a byproduct of the process, a fluorocarbon residue is deposited on exposed surfaces and must be removed for subsequent processing. Conventional fluorocarbon cleaning processes typically...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2006
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| Online Access: | http://hdl.handle.net/1853/10583 |