Process Window Challenges in Advanced Manufacturing: New Materials and Integration Solutions

Process Window Challenges in Advanced Manufacturing: New Materials and Integration Solutions

With the continued progression of Moore’s law into the sub-14nm technology nodes, interconnect RC and power dissipation scaling play an increasingly important role in overall product performance. As critical dimensions in the mainstream Cu/ULK interconnect system shrink below 30nm, corresponding inc...

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Bibliographic Details
Main Authors: Fox, Robert, Augur, Rod, Child, Craig, Zaleski, Mark
Other Authors: TU Chemnitz, Fakultät für Elektrotechnik und Informationstechnik
Format: Others
Language:English
Published: Universitätsbibliothek Chemnitz 2016
Subjects:
semiconductor manufacturing
process window
back end of line (BEOL)
process integration
novel materials
ddc:620
Halbleiterindustrie
Integration
Online Access:http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207003
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207003
http://www.qucosa.de/fileadmin/data/qucosa/documents/20700/Fox_Process_Window_Challenges_in_Advanced_Manufacturing.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/20700/signatur.txt.asc

Internet

http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207003
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207003
http://www.qucosa.de/fileadmin/data/qucosa/documents/20700/Fox_Process_Window_Challenges_in_Advanced_Manufacturing.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/20700/signatur.txt.asc

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