Gallium-based Solid Liquid Interdiffusion Bonding of Semiconductor Substrates near room temperature

Within this work, bonding technologies based upon the alloying of gallium with other metals to assemble semiconductor substrates for the possible application of encapsulation and 3D-integration of micro systems and devices have been researched. Motivated by the important demand to achieve low temper...

Full description

Bibliographic Details
Main Author: Froemel, Joerg
Other Authors: TU Chemnitz, Fakultät für Elektrotechnik und Informationstechnik
Format: Doctoral Thesis
Language:English
Published: Universitätsbibliothek Chemnitz 2015
Subjects:
Online Access:http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-167981
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-167981
http://www.qucosa.de/fileadmin/data/qucosa/documents/16798/Dissertation_Froemel.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/16798/signatur.txt.asc