Preparation and characterization of Carbon Nanotube based vertical interconnections for integrated circuits

Preparation and characterization of Carbon Nanotube based vertical interconnections for integrated circuits

(ULSI) causes an increase of the resistance of the wiring system by increased scattering of electrons at side walls and grain boundaries in the state of the art Cu technology, which increases the RC delay of the interconnect system and thus degrades the performance of the device. The outstanding pro...

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Bibliographic Details
Main Author: Fiedler, Holger
Other Authors: TU Chemnitz, Fakultät für Elektrotechnik und Informationstechnik
Format: Doctoral Thesis
Language:English
Published: Universitätsbibliothek Chemnitz 2014
Subjects:
Kohlenstoffnanoröhren (CNT)
Integration
Leitbahnsystem
Metall
Chemische Dampfphasenabscheidung (CVD)
Rasterkraftmikroskopie (AFM)
Ramanspektroskopie
Elektrischer Transport
Transmissionselektronenstrahlmikroskopie (TEM)
Kontakt
Temperaturkoeffizient des elektrischen Widerstandes (TCR)
Carbon nanotube (CNT)
Interconnect
Metal
Chemical vapor deposition (CVD)
Atomic Force Microscopy (AFM)
Raman spectroscopy
Electrical transport
Transmission electron microscopy (TEM)
Contact
Temperature coefficient of resistance (TCR)
ddc:620
ddc:537
Rasterkraftmikroskopie
Online Access:http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-149474
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-149474
http://www.qucosa.de/fileadmin/data/qucosa/documents/14947/Dissertation_Holger_Fiedler_PDF.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/14947/signatur.txt.asc

Internet

http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-149474
http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-149474
http://www.qucosa.de/fileadmin/data/qucosa/documents/14947/Dissertation_Holger_Fiedler_PDF.pdf
http://www.qucosa.de/fileadmin/data/qucosa/documents/14947/signatur.txt.asc

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