Molecular dynamics simulation of thermal energy transport in polydimethylsiloxane (PDMS)

Heat transfer across thermal interface materials is a critical issue for microelectronics thermal management. Polydimethylsiloxane (PDMS), one of the most important components of thermal interface materials presents a large barrier for heat flow due to its low thermal conductivity. In this paper, we...

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Bibliographic Details
Main Authors: Luo, Tengfei (Contributor), Esfarjani, Keivan (Contributor), Shiomi, Junichiro (Contributor), Henry, Asegun (Contributor), Chen, Gang (Contributor)
Other Authors: Massachusetts Institute of Technology. Department of Mechanical Engineering (Contributor)
Format: Article
Language:English
Published: American Institute of Physics (AIP), 2013-04-02T18:22:41Z.
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