On the charging and thermal characterization of a micro/nano structured thermal ground plane
As power densities in electronic devices have increased dramatically over the last decade, advanced thermal management solutions are required. A significant part of the thermal resistance budget is commonly taken up by the heat spreader, which serves to reduce the input heat flux and connect to an i...
| Main Authors: | , , , , , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers (IEEE),
2012-09-25T12:47:53Z.
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| Subjects: | |
| Online Access: | Get fulltext |