Toward Optimal Heat Transfer of 2D-3D Heterostructures via van der Waals Binding Effects
Two-dimensional (2D) materials and their heterogeneous integration have enabled promising electronic and photonic applications. However, significant thermal challenges arise due to numerous van der Waals (vdW) interfaces limiting the dissipation of heat generated in the device. In this work, we inve...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
American Chemical Society (ACS),
2022-04-25T16:45:26Z.
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| Subjects: | |
| Online Access: | Get fulltext |