Ultralow Resistance Ohmic Contacts for p-Channel InGaSb Field-Effect Transistors

• Main Authors: Guo, Luke W. (Contributor), Bennett, Brian R. (Author), Boos, John Brad (Author), Del Alamo, Jesus A. (Author), Lu, Wenjie (Contributor), del Alamo, Jesus A. (Contributor)
• Other Authors: Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science (Contributor), Massachusetts Institute of Technology. Microsystems Technology Laboratories (Contributor)
• Format: Article
• Language: English
• Published: Institute of Electrical and Electronics Engineers (IEEE), 2016-04-28T16:25:31Z.
• Subjects: Article
• Online Access: Get fulltext

 We demonstrate ultralow ohmic contact resistance to antimonide-based, p-channel quantum-well field-effect transistor (QW-FET) structures using a new p[superscript ±]-InAs/InAsSb cap structure. The incorporation of a p[superscript ±]-InAsSb layer enables the use of a thicker cap with lower sheet resistance, resulting in an improved contact resistivity. Using a Pd-based ohmic scheme, the composite cap structure resulted in a 4x reduction in contact resistance compared with a standard p[superscript ±]-InAs cap. This translates into nearly 3x improvement in the gm of fabricated InGaSb p-channel QW-FETs. Furthermore, Ni contacts on the composite cap were fabricated and a contact resistance of 45 Ω · μm was obtained. An accurate contact resistivity extraction in this very low range is possible through nanotransmission line models with sub-100 nm contacts. In devices of this kind with Ni-based contacts, we derive an ultralow contact resistivity of 5.2 · 10[superscript -8] Ω · cm[superscript 2].