An experimental investigation on partial-ductile mode grinding of silicon
This research work was primarily concentrated on precise ductile-mode grinding (milling) of flat surfaces of silicon, mainly Integrated Circuit (IC) silicon chips (dies), which were about 700 µm thick and the top of their surfaces covered with a silicon nitride layer. Substantial amount of partial...
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| Format: | Thesis |
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2002.
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| Online Access: | Get fulltext |