Numerical Simulation Of A Microchannel For Microelectronic Cooling

The paper discusses the numerical simulation of a micro-channel heat sink in microelectronics cooling. A three-dimensional Computational Fluid Dynamics (CFD) model was built using the commercial package, FLUENT, to investigate the conjugate fluid flow and heat transfer phenomena in a silicon-based r...

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Bibliographic Details
Main Authors: Wong, Wai Hing (Author), Mohd. Ghazali, Normah (Author)
Format: Article
Language:English
Published: Penerbit UTM Press, 2007-06.
Subjects:
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