Generation of Self-Assembled 3D Network in TPU by Insertion of Al<sub>2</sub>O<sub>3</sub>/<i>h</i>-BN Hybrid for Thermal Conductivity Enhancement

Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethan...

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Bibliographic Details
Main Authors: Kai-Han Su, Cherng-Yuh Su, Po-Wei Chi, Prem Chandan, Cheng-Ta Cho, Wan-Yu Chi, Maw-Kuen Wu
Format: Article
Language:English
Published: MDPI AG 2021-01-01
Series:Materials
Subjects:
TPU
Online Access:https://www.mdpi.com/1996-1944/14/2/238
Description
Summary:Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Our results demonstrate that the incorporation of spherical hybrid ABN filler assists in the formation of a three-dimensional continuous heat conduction structure that enhances the thermal conductivity of the neat thermoplastic TPU matrix. Hence, we present a valuable method for preparing the thermal interface materials (TIMs) with high thermal conductivity, and this method can also be applied to large-scale manufacturing.
ISSN:1996-1944