Generation of Self-Assembled 3D Network in TPU by Insertion of Al<sub>2</sub>O<sub>3</sub>/<i>h</i>-BN Hybrid for Thermal Conductivity Enhancement

Generation of Self-Assembled 3D Network in TPU by Insertion of Al<sub>2</sub>O<sub>3</sub>/<i>h</i>-BN Hybrid for Thermal Conductivity Enhancement

Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethan...

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Bibliographic Details
Main Authors: Kai-Han Su, Cherng-Yuh Su, Po-Wei Chi, Prem Chandan, Cheng-Ta Cho, Wan-Yu Chi, Maw-Kuen Wu
Format: Article
Language:English
Published: MDPI AG 2021-01-01
Series:Materials
Subjects:
TPU
Al<sub>2</sub>O<sub>3</sub>/<i>h</i>-BN hybrid
thermal interface materials (TIMs)
self-assembled 3D network
thermal conductivity
Online Access:https://www.mdpi.com/1996-1944/14/2/238

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https://www.mdpi.com/1996-1944/14/2/238

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