Optimizing The Organic/Inorganic Barrier Structure For Flexible Plastic Substrate Encapsulation

Optimizing The Organic/Inorganic Barrier Structure For Flexible Plastic Substrate Encapsulation

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A multilayered barrier structure stacked with organosilicon and silicon oxide (SiOx) films consecutively prepared using plasma-enhanced chemical vapor deposition (PECVD) was developed to encapsulate flexible plastic substrate. The evolution on the residual internal stress, structural quality of th...

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Bibliographic Details
Main Authors: Yi-Chiuan Lin, Quoc-Khoa Le, Li-Wei Lai, Ren-Mao Liao, Ming-Shin Jeng, Day-Shan Liu
Format: Article
Language:English
Published: Taiwan Association of Engineering and Technology Innovation 2012-07-01
Series:International Journal of Engineering and Technology Innovation
Subjects:
Multilayered barrier structure
organosilicon/SiOx
plasma-enhanced chemical vapor deposition
flexible plastic substrate
residual internal stress
adhesion
water vapor transmission rate
Online Access:http://sparc.nfu.edu.tw/~ijeti/download/V2-no3-184-194.pdf

Internet

http://sparc.nfu.edu.tw/~ijeti/download/V2-no3-184-194.pdf

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