Investigating on Through Glass via Based RF Passives for 3-D Integration
Due to low dielectric loss and low cost, glass is developed as a promising material for advanced interposers in 2.5-D and 3-D integration. In this paper, through glass vias (TGVs) are used to implement inductors for minimal footprint and large quality factor. Based on the proposed physical structure...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2018-01-01
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| Series: | IEEE Journal of the Electron Devices Society |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/8391707/ |