Architecture and Process Integration Overview of 3D NAND Flash Technologies

Architecture and Process Integration Overview of 3D NAND Flash Technologies

In the past few decades, NAND flash memory has been one of the most successful nonvolatile storage technologies, and it is commonly used in electronic devices because of its high scalability and reliable switching properties. To overcome the scaling limit of planar NAND flash arrays, various three-d...

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Main Authors: Geun Ho Lee, Sungmin Hwang, Junsu Yu, Hyungjin Kim
Format: Article
Language:English
Published: MDPI AG 2021-07-01
Series:Applied Sciences
Subjects:
NAND flash memory
three-dimensional architecture
process integration
Online Access:https://www.mdpi.com/2076-3417/11/15/6703
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spelling doaj-fd1e5579bf9e450cbf52874a607ffb532021-08-06T15:18:24ZengMDPI AGApplied Sciences2076-34172021-07-01116703670310.3390/app11156703Architecture and Process Integration Overview of 3D NAND Flash TechnologiesGeun Ho Lee0Sungmin Hwang1Junsu Yu2Hyungjin Kim3Department of Electronic Engineering, Inha University, Incheon 22212, KoreaDepartment of Electrical and Computer Engineering, Seoul National University, Seoul 08826, KoreaDepartment of Electrical and Computer Engineering, Seoul National University, Seoul 08826, KoreaDepartment of Electronic Engineering, Inha University, Incheon 22212, KoreaIn the past few decades, NAND flash memory has been one of the most successful nonvolatile storage technologies, and it is commonly used in electronic devices because of its high scalability and reliable switching properties. To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated in both industry and academia and adopted in commercial mass production. In this paper, 3D NAND flash technologies are reviewed in terms of their architecture and fabrication methods, and the advantages and disadvantages of the architectures are compared.https://www.mdpi.com/2076-3417/11/15/6703NAND flash memorythree-dimensional architectureprocess integration
collection DOAJ
language English
format Article
sources DOAJ
author Geun Ho Lee
Sungmin Hwang
Junsu Yu
Hyungjin Kim
spellingShingle Geun Ho Lee
Sungmin Hwang
Junsu Yu
Hyungjin Kim
Architecture and Process Integration Overview of 3D NAND Flash Technologies
Applied Sciences
NAND flash memory
three-dimensional architecture
process integration
author_facet Geun Ho Lee
Sungmin Hwang
Junsu Yu
Hyungjin Kim
author_sort Geun Ho Lee
title Architecture and Process Integration Overview of 3D NAND Flash Technologies
title_short Architecture and Process Integration Overview of 3D NAND Flash Technologies
title_full Architecture and Process Integration Overview of 3D NAND Flash Technologies
title_fullStr Architecture and Process Integration Overview of 3D NAND Flash Technologies
title_full_unstemmed Architecture and Process Integration Overview of 3D NAND Flash Technologies
title_sort architecture and process integration overview of 3d nand flash technologies
publisher MDPI AG
series Applied Sciences
issn 2076-3417
publishDate 2021-07-01
description In the past few decades, NAND flash memory has been one of the most successful nonvolatile storage technologies, and it is commonly used in electronic devices because of its high scalability and reliable switching properties. To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated in both industry and academia and adopted in commercial mass production. In this paper, 3D NAND flash technologies are reviewed in terms of their architecture and fabrication methods, and the advantages and disadvantages of the architectures are compared.
topic NAND flash memory
three-dimensional architecture
process integration
url https://www.mdpi.com/2076-3417/11/15/6703
work_keys_str_mv AT geunholee architectureandprocessintegrationoverviewof3dnandflashtechnologies
AT sungminhwang architectureandprocessintegrationoverviewof3dnandflashtechnologies
AT junsuyu architectureandprocessintegrationoverviewof3dnandflashtechnologies
AT hyungjinkim architectureandprocessintegrationoverviewof3dnandflashtechnologies
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