An Optical Inspection System Development for Defects on Multi-surfaces of Chips
We proposed a new architecture with multiple pick and place heads to suck inspected chips and to be moved synchronously for acquiring the images of different surfaces on different chips at their corresponding acquisition stations. The computation loading of defect inspection for each chip also can b...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2016-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | http://dx.doi.org/10.1051/matecconf/20166812003 |