Learning Localized Spatial Material Properties of Substrates in Ultra-Thin Packages Using Markov Chain Monte Carlo and Finite Element Analysis
Thinned silicon dies and thin substrates using thin core and coreless structures have enabled thin packages. For robust manufacturing and reliability of these parts, solving the warpage problem is key. While current finite element methodologies can provide some insights at the design stage, these si...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2020-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9032179/ |