A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

This paper presents a high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging. An approach to maintaining high-vacuum conditions by integrating the MEMS fabrication process with getter material preparation is presented in this pa...

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Bibliographic Details
Main Authors: Zhenyu Luo, Deyong Chen, Junbo Wang, Yinan Li, Jian Chen
Format: Article
Language:English
Published: MDPI AG 2014-12-01
Series:Sensors
Subjects:
resonant
pressure sensor
through-glass via
anodic bonding
Q-factor
vacuum packaging
Online Access:http://www.mdpi.com/1424-8220/14/12/24244

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http://www.mdpi.com/1424-8220/14/12/24244

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