An Ultra-Wideband Compact TR Module Based on 3-D Packaging
This study presents a novel four-channel tile-type T/R module which achieves excellent performances in ultra-wideband (2–12 GHz) and integrates all circuits in a super-light (25 g) and compact (27.8 × 27.8 × 12 mm<sup>3</sup>) mechanical structure in active phased array systems. The key...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-06-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/10/12/1435 |