Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains
By modifying the accumulative roll-bonding (ARB) procedures, accumulative roll-bonding (ARB) processing up to 30 cycles (N) with a 50% thickness reduction per cycle (equivalent strain = 24) at room temperature was conducted on pure copper. The bonding condition, microhardness and electrical conducti...
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MDPI AG
2016-05-01
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| Series: | Metals |
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| Online Access: | http://www.mdpi.com/2075-4701/6/5/115 |
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doaj-f7443448321a417fbb08e6aa0552a2c52020-11-25T02:32:43ZengMDPI AGMetals2075-47012016-05-016511510.3390/met6050115met6050115Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh StrainsGongcheng Yao0Qingsong Mei1Juying Li2Congling Li3Ye Ma4Feng Chen5Guodong Zhang6Bing Yang7School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaSchool of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaSchool of Mechanical Engineering, Wuhan Polytechnic University, Wuhan 430023, ChinaSchool of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaSchool of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaSchool of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaSchool of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaSchool of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaBy modifying the accumulative roll-bonding (ARB) procedures, accumulative roll-bonding (ARB) processing up to 30 cycles (N) with a 50% thickness reduction per cycle (equivalent strain = 24) at room temperature was conducted on pure copper. The bonding condition, microhardness and electrical conductivity of the ARBed Cu were studied. Results showed that good bonding condition of the samples was achieved. As N increases, the microhardness of ARBed Cu increases, reaching ~2.9 times that of annealed Cu for N = 30. The electrical conductivity of ARBed Cu decreases slightly but with periodic fluctuations for N > 10, with a minimum of 90.4% IACS for N = 30. Our study indicated that ARB can be an effective way to produce high-hardness and high-conductivity pure copper better than or comparable to Cu alloys and Cu based composites as reported.http://www.mdpi.com/2075-4701/6/5/115accumulative roll-bondingpure coppermicrohardnesselectrical conductivity |
| collection |
DOAJ |
| language |
English |
| format |
Article |
| sources |
DOAJ |
| author |
Gongcheng Yao Qingsong Mei Juying Li Congling Li Ye Ma Feng Chen Guodong Zhang Bing Yang |
| spellingShingle |
Gongcheng Yao Qingsong Mei Juying Li Congling Li Ye Ma Feng Chen Guodong Zhang Bing Yang Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains Metals accumulative roll-bonding pure copper microhardness electrical conductivity |
| author_facet |
Gongcheng Yao Qingsong Mei Juying Li Congling Li Ye Ma Feng Chen Guodong Zhang Bing Yang |
| author_sort |
Gongcheng Yao |
| title |
Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains |
| title_short |
Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains |
| title_full |
Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains |
| title_fullStr |
Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains |
| title_full_unstemmed |
Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains |
| title_sort |
hard copper with good electrical conductivity fabricated by accumulative roll-bonding to ultrahigh strains |
| publisher |
MDPI AG |
| series |
Metals |
| issn |
2075-4701 |
| publishDate |
2016-05-01 |
| description |
By modifying the accumulative roll-bonding (ARB) procedures, accumulative roll-bonding (ARB) processing up to 30 cycles (N) with a 50% thickness reduction per cycle (equivalent strain = 24) at room temperature was conducted on pure copper. The bonding condition, microhardness and electrical conductivity of the ARBed Cu were studied. Results showed that good bonding condition of the samples was achieved. As N increases, the microhardness of ARBed Cu increases, reaching ~2.9 times that of annealed Cu for N = 30. The electrical conductivity of ARBed Cu decreases slightly but with periodic fluctuations for N > 10, with a minimum of 90.4% IACS for N = 30. Our study indicated that ARB can be an effective way to produce high-hardness and high-conductivity pure copper better than or comparable to Cu alloys and Cu based composites as reported. |
| topic |
accumulative roll-bonding pure copper microhardness electrical conductivity |
| url |
http://www.mdpi.com/2075-4701/6/5/115 |
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