Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests
The microbump (μ-bump) reliability of 3D integrated circuit (3D-IC) packaging must be enhanced, in consideration of the multi-chip assembly, during temperature cycling tests (TCT). This research proposes vehicle fabrications, experimental implements, and a nonlinear finite element analysis to system...
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| Format: | Article |
| Language: | English |
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MDPI AG
2017-10-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/10/10/1220 |