A kinetic model of copper-to-copper direct bonding under thermal compression
A surface creep model is presented for analyzing Cu-to-Cu direct bonding under thermal compression. The driving force is a pressure gradient, which squeezes layers of atoms to fill voids at the bonding interface. The link among the key parameters of surface roughness, experimental bonding time, temp...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785421010528 |