High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer

High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer

Modern design-conscious products have raised the development of advanced electronic fabricating technologies. These widely used industrial technologies show high compatibility for inorganic materials and capacity for mass production. However, the morphology accuracy is hard to ensure and cracks happ...

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Bibliographic Details
Main Authors: Kang Wu, Qifeng Zhou, Huaping Zou, Kangmin Leng, Yifan Zeng, Zhigang Wu
Format: Article
Language:English
Published: MDPI AG 2019-02-01
Series:Micromachines
Subjects:
thermoforming
high precision
phase change
laminated structures
cracks and delamination
Online Access:https://www.mdpi.com/2072-666X/10/3/160

Internet

https://www.mdpi.com/2072-666X/10/3/160

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