Good-Quality and High-Efficiency Dicing for Thick LiNbO<sub>3</sub> Wafers Using Picosecond Laser Pulses

Lithium niobate (LiNbO<sub>3</sub>) has become popular with applications in electronics and communication industries due to its excellent electro-optical and nonlinear properties. This paper presents the influence of laser power, repetition frequency, number of subpulses, depth of each p...

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Main Authors:	Mingwei Lei, Wenyan Gao, Guang Li, Xinping Wu, Benhai Li, Xuefeng Wang, Junlong Wang
Format:	Article
Language:	English
Published:	MDPI AG 2019-12-01
Series:	Micromachines
Subjects:	laser dicing picosecond laser dicing quality optimization thick lithium niobate (linbo<sub>3</sub>) wafers
Online Access:	https://www.mdpi.com/2072-666X/11/1/51

id	doaj-f0515b357c1544eda9fc210e96dcbdb0
record_format	Article
spelling	doaj-f0515b357c1544eda9fc210e96dcbdb02020-11-25T02:18:24ZengMDPI AGMicromachines2072-666X2019-12-011115110.3390/mi11010051mi11010051Good-Quality and High-Efficiency Dicing for Thick LiNbO<sub>3</sub> Wafers Using Picosecond Laser PulsesMingwei Lei0Wenyan Gao1Guang Li2Xinping Wu3Benhai Li4Xuefeng Wang5Junlong Wang6Beijing Institute of Aerospace Control Devices, Beijing 100094, ChinaBeijing Institute of Aerospace Control Devices, Beijing 100094, ChinaBeijing Institute of Aerospace Control Devices, Beijing 100094, ChinaBeijing Institute of Aerospace Control Devices, Beijing 100094, ChinaBeijing Institute of Aerospace Control Devices, Beijing 100094, ChinaBeijing Institute of Aerospace Control Devices, Beijing 100094, ChinaBeijing Institute of Aerospace Control Devices, Beijing 100094, ChinaLithium niobate (LiNbO<sub>3</sub>) has become popular with applications in electronics and communication industries due to its excellent electro-optical and nonlinear properties. This paper presents the influence of laser power, repetition frequency, number of subpulses, depth of each pass, and scanning velocity in picosecond laser dicing on multiple characteristics of LiNbO<sub>3</sub> using the Taguchi method. By means of analysis of variance and analysis of relations between the characteristics, the optimal ps-laser-dicing parameter is obtained with good quality and high efficiency, which is applied to LiNbO<sub>3</sub> products. The result indicates that picosecond laser dicing provides an alternative to machine thick LiNbO<sub>3</sub> wafers with narrow kerf width, micro chipping, smooth surface, and high productivity.https://www.mdpi.com/2072-666X/11/1/51laser dicingpicosecond laserdicing quality optimizationthick lithium niobate (linbo<sub>3</sub>) wafers
collection	DOAJ
language	English
format	Article
sources	DOAJ
author	Mingwei Lei Wenyan Gao Guang Li Xinping Wu Benhai Li Xuefeng Wang Junlong Wang
spellingShingle	Mingwei Lei Wenyan Gao Guang Li Xinping Wu Benhai Li Xuefeng Wang Junlong Wang Good-Quality and High-Efficiency Dicing for Thick LiNbO<sub>3</sub> Wafers Using Picosecond Laser Pulses Micromachines laser dicing picosecond laser dicing quality optimization thick lithium niobate (linbo<sub>3</sub>) wafers
author_facet	Mingwei Lei Wenyan Gao Guang Li Xinping Wu Benhai Li Xuefeng Wang Junlong Wang
author_sort	Mingwei Lei
title	Good-Quality and High-Efficiency Dicing for Thick LiNbO<sub>3</sub> Wafers Using Picosecond Laser Pulses
title_short	Good-Quality and High-Efficiency Dicing for Thick LiNbO<sub>3</sub> Wafers Using Picosecond Laser Pulses
title_full	Good-Quality and High-Efficiency Dicing for Thick LiNbO<sub>3</sub> Wafers Using Picosecond Laser Pulses
title_fullStr	Good-Quality and High-Efficiency Dicing for Thick LiNbO<sub>3</sub> Wafers Using Picosecond Laser Pulses
title_full_unstemmed	Good-Quality and High-Efficiency Dicing for Thick LiNbO<sub>3</sub> Wafers Using Picosecond Laser Pulses
title_sort	good-quality and high-efficiency dicing for thick linbo<sub>3</sub> wafers using picosecond laser pulses
publisher	MDPI AG
series	Micromachines
issn	2072-666X
publishDate	2019-12-01
description	Lithium niobate (LiNbO<sub>3</sub>) has become popular with applications in electronics and communication industries due to its excellent electro-optical and nonlinear properties. This paper presents the influence of laser power, repetition frequency, number of subpulses, depth of each pass, and scanning velocity in picosecond laser dicing on multiple characteristics of LiNbO<sub>3</sub> using the Taguchi method. By means of analysis of variance and analysis of relations between the characteristics, the optimal ps-laser-dicing parameter is obtained with good quality and high efficiency, which is applied to LiNbO<sub>3</sub> products. The result indicates that picosecond laser dicing provides an alternative to machine thick LiNbO<sub>3</sub> wafers with narrow kerf width, micro chipping, smooth surface, and high productivity.
topic	laser dicing picosecond laser dicing quality optimization thick lithium niobate (linbo<sub>3</sub>) wafers
url	https://www.mdpi.com/2072-666X/11/1/51
work_keys_str_mv	AT mingweilei goodqualityandhighefficiencydicingforthicklinbosub3subwafersusingpicosecondlaserpulses AT wenyangao goodqualityandhighefficiencydicingforthicklinbosub3subwafersusingpicosecondlaserpulses AT guangli goodqualityandhighefficiencydicingforthicklinbosub3subwafersusingpicosecondlaserpulses AT xinpingwu goodqualityandhighefficiencydicingforthicklinbosub3subwafersusingpicosecondlaserpulses AT benhaili goodqualityandhighefficiencydicingforthicklinbosub3subwafersusingpicosecondlaserpulses AT xuefengwang goodqualityandhighefficiencydicingforthicklinbosub3subwafersusingpicosecondlaserpulses AT junlongwang goodqualityandhighefficiencydicingforthicklinbosub3subwafersusingpicosecondlaserpulses
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Good-Quality and High-Efficiency Dicing for Thick LiNbO<sub>3</sub> Wafers Using Picosecond Laser Pulses

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