Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys
This study investigates microstructures and mechanical properties of the alloys obtained by adding Cu (0.7 % and 0.9 %) and Al (0.7 % and 0.9 %) to lead-free Sn-9Zn eutectic soldering alloy produced by investment casting method. The results show that Cu5Zn8 phase has formed in the structure of Cu ad...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Sciendo
2020-03-01
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| Series: | Materials Science-Poland |
| Subjects: | |
| Online Access: | http://www.degruyter.com/view/j/msp.2019.38.issue-1/msp-2020-0025/msp-2020-0025.xml?format=INT |