Internal defects inspection of TSV 3D package based on thermal distribution analysis
A small aperture, fine pitch, and high aspect ratio have been the characteristics of through silicon via (TSV) 3D packaging technology. Thus, the requirements of TSV quality are becoming higher and higher. In order to improve the reliability of TSV 3D packaging, it is necessary to find an effective...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2021-08-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0056714 |