One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
American Chemical Society
2019-04-01
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| Series: | ACS Omega |
| Online Access: | http://dx.doi.org/10.1021/acsomega.8b03533 |