Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 μm Low-Voltage CMOS Technology
This paper proposes a new implementation method to significantly improve the magnetic sensitivity of a fully symmetric vertical Hall device (FSVHD) based on low-voltage CMOS technology. The FSVHD consists of four identical three-contact vertical Hall elements (3CVHE) and each 3CVHE is located in a l...
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doaj-e40f36bcc7bd4345b1607d9bd5abcbc52021-09-16T23:00:11ZengIEEEIEEE Journal of the Electron Devices Society2168-67342021-01-01982082610.1109/JEDS.2021.31116879534868Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 μm Low-Voltage CMOS TechnologyHaiyun Huang0Yue Xu1https://orcid.org/0000-0003-3265-7907College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, ChinaCollege of Electronic and Optical Engineering, National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology, Nanjing University of Posts and Telecommunications, Nanjing, ChinaThis paper proposes a new implementation method to significantly improve the magnetic sensitivity of a fully symmetric vertical Hall device (FSVHD) based on low-voltage CMOS technology. The FSVHD consists of four identical three-contact vertical Hall elements (3CVHE) and each 3CVHE is located in a low-doped deep n-well. The terminals of the 3CVHE are <inline-formula> <tex-math notation="LaTeX">$\text{n}^{+}$ </tex-math></inline-formula> implanted in an n-well and a <inline-formula> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula> implantation in a p-well is performed to act as a trench between two adjacent <inline-formula> <tex-math notation="LaTeX">$\text{n}^{+}$ </tex-math></inline-formula> contacts, enabling Hall current flowing deeply for sensitivity improvement. The influence of the geometry sizes on magnetic sensitivity is exploited utilizing TCAD simulation to obtain the optimized device structure in a <inline-formula> <tex-math notation="LaTeX">$0.18~\mu\text{m}$ </tex-math></inline-formula> CMOS standard technology. The experimental results reveal that the proposed FSVHD with a <inline-formula> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula>/p-well trench can attain an improved voltage-related sensitivity of 8.4 mV/VT, which is about 70% higher than that of a conventional FSVHD without a trench in the same CMOS fabrication process, while offset and noise are not degraded. The proposed <inline-formula> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula>/p-well implantation trench is a good solution to enhance the sensitivity of a low-voltage CMOS VHD with a low manufacturing cost.https://ieeexplore.ieee.org/document/9534868/Vertical hall devicemagnetic sensitivitytrenchstandard CMOS 14 technology |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Haiyun Huang Yue Xu |
spellingShingle |
Haiyun Huang Yue Xu Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 μm Low-Voltage CMOS Technology IEEE Journal of the Electron Devices Society Vertical hall device magnetic sensitivity trench standard CMOS 14 technology |
author_facet |
Haiyun Huang Yue Xu |
author_sort |
Haiyun Huang |
title |
Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 μm Low-Voltage CMOS Technology |
title_short |
Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 μm Low-Voltage CMOS Technology |
title_full |
Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 μm Low-Voltage CMOS Technology |
title_fullStr |
Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 μm Low-Voltage CMOS Technology |
title_full_unstemmed |
Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 μm Low-Voltage CMOS Technology |
title_sort |
sensitivity improvement of a fully symmetric vertical hall device fabricated in 0.18 μm low-voltage cmos technology |
publisher |
IEEE |
series |
IEEE Journal of the Electron Devices Society |
issn |
2168-6734 |
publishDate |
2021-01-01 |
description |
This paper proposes a new implementation method to significantly improve the magnetic sensitivity of a fully symmetric vertical Hall device (FSVHD) based on low-voltage CMOS technology. The FSVHD consists of four identical three-contact vertical Hall elements (3CVHE) and each 3CVHE is located in a low-doped deep n-well. The terminals of the 3CVHE are <inline-formula> <tex-math notation="LaTeX">$\text{n}^{+}$ </tex-math></inline-formula> implanted in an n-well and a <inline-formula> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula> implantation in a p-well is performed to act as a trench between two adjacent <inline-formula> <tex-math notation="LaTeX">$\text{n}^{+}$ </tex-math></inline-formula> contacts, enabling Hall current flowing deeply for sensitivity improvement. The influence of the geometry sizes on magnetic sensitivity is exploited utilizing TCAD simulation to obtain the optimized device structure in a <inline-formula> <tex-math notation="LaTeX">$0.18~\mu\text{m}$ </tex-math></inline-formula> CMOS standard technology. The experimental results reveal that the proposed FSVHD with a <inline-formula> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula>/p-well trench can attain an improved voltage-related sensitivity of 8.4 mV/VT, which is about 70% higher than that of a conventional FSVHD without a trench in the same CMOS fabrication process, while offset and noise are not degraded. The proposed <inline-formula> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula>/p-well implantation trench is a good solution to enhance the sensitivity of a low-voltage CMOS VHD with a low manufacturing cost. |
topic |
Vertical hall device magnetic sensitivity trench standard CMOS 14 technology |
url |
https://ieeexplore.ieee.org/document/9534868/ |
work_keys_str_mv |
AT haiyunhuang sensitivityimprovementofafullysymmetricverticalhalldevicefabricatedin018x03bcmlowvoltagecmostechnology AT yuexu sensitivityimprovementofafullysymmetricverticalhalldevicefabricatedin018x03bcmlowvoltagecmostechnology |
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1717377939968884736 |