Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 μm Low-Voltage CMOS Technology

This paper proposes a new implementation method to significantly improve the magnetic sensitivity of a fully symmetric vertical Hall device (FSVHD) based on low-voltage CMOS technology. The FSVHD consists of four identical three-contact vertical Hall elements (3CVHE) and each 3CVHE is located in a l...

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Main Authors: Haiyun Huang, Yue Xu
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9534868/
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spelling doaj-e40f36bcc7bd4345b1607d9bd5abcbc52021-09-16T23:00:11ZengIEEEIEEE Journal of the Electron Devices Society2168-67342021-01-01982082610.1109/JEDS.2021.31116879534868Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 &#x03BC;m Low-Voltage CMOS TechnologyHaiyun Huang0Yue Xu1https://orcid.org/0000-0003-3265-7907College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, ChinaCollege of Electronic and Optical Engineering, National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology, Nanjing University of Posts and Telecommunications, Nanjing, ChinaThis paper proposes a new implementation method to significantly improve the magnetic sensitivity of a fully symmetric vertical Hall device (FSVHD) based on low-voltage CMOS technology. The FSVHD consists of four identical three-contact vertical Hall elements (3CVHE) and each 3CVHE is located in a low-doped deep n-well. The terminals of the 3CVHE are <inline-formula> <tex-math notation="LaTeX">$\text{n}^{+}$ </tex-math></inline-formula> implanted in an n-well and a <inline-formula> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula> implantation in a p-well is performed to act as a trench between two adjacent <inline-formula> <tex-math notation="LaTeX">$\text{n}^{+}$ </tex-math></inline-formula> contacts, enabling Hall current flowing deeply for sensitivity improvement. The influence of the geometry sizes on magnetic sensitivity is exploited utilizing TCAD simulation to obtain the optimized device structure in a <inline-formula> <tex-math notation="LaTeX">$0.18~\mu\text{m}$ </tex-math></inline-formula> CMOS standard technology. The experimental results reveal that the proposed FSVHD with a <inline-formula> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula>/p-well trench can attain an improved voltage-related sensitivity of 8.4 mV/VT, which is about 70&#x0025; higher than that of a conventional FSVHD without a trench in the same CMOS fabrication process, while offset and noise are not degraded. The proposed <inline-formula> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula>/p-well implantation trench is a good solution to enhance the sensitivity of a low-voltage CMOS VHD with a low manufacturing cost.https://ieeexplore.ieee.org/document/9534868/Vertical hall devicemagnetic sensitivitytrenchstandard CMOS 14 technology
collection DOAJ
language English
format Article
sources DOAJ
author Haiyun Huang
Yue Xu
spellingShingle Haiyun Huang
Yue Xu
Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 &#x03BC;m Low-Voltage CMOS Technology
IEEE Journal of the Electron Devices Society
Vertical hall device
magnetic sensitivity
trench
standard CMOS 14 technology
author_facet Haiyun Huang
Yue Xu
author_sort Haiyun Huang
title Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 &#x03BC;m Low-Voltage CMOS Technology
title_short Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 &#x03BC;m Low-Voltage CMOS Technology
title_full Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 &#x03BC;m Low-Voltage CMOS Technology
title_fullStr Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 &#x03BC;m Low-Voltage CMOS Technology
title_full_unstemmed Sensitivity Improvement of a Fully Symmetric Vertical Hall Device Fabricated in 0.18 &#x03BC;m Low-Voltage CMOS Technology
title_sort sensitivity improvement of a fully symmetric vertical hall device fabricated in 0.18 &#x03bc;m low-voltage cmos technology
publisher IEEE
series IEEE Journal of the Electron Devices Society
issn 2168-6734
publishDate 2021-01-01
description This paper proposes a new implementation method to significantly improve the magnetic sensitivity of a fully symmetric vertical Hall device (FSVHD) based on low-voltage CMOS technology. The FSVHD consists of four identical three-contact vertical Hall elements (3CVHE) and each 3CVHE is located in a low-doped deep n-well. The terminals of the 3CVHE are <inline-formula> <tex-math notation="LaTeX">$\text{n}^{+}$ </tex-math></inline-formula> implanted in an n-well and a <inline-formula> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula> implantation in a p-well is performed to act as a trench between two adjacent <inline-formula> <tex-math notation="LaTeX">$\text{n}^{+}$ </tex-math></inline-formula> contacts, enabling Hall current flowing deeply for sensitivity improvement. The influence of the geometry sizes on magnetic sensitivity is exploited utilizing TCAD simulation to obtain the optimized device structure in a <inline-formula> <tex-math notation="LaTeX">$0.18~\mu\text{m}$ </tex-math></inline-formula> CMOS standard technology. The experimental results reveal that the proposed FSVHD with a <inline-formula> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula>/p-well trench can attain an improved voltage-related sensitivity of 8.4 mV/VT, which is about 70&#x0025; higher than that of a conventional FSVHD without a trench in the same CMOS fabrication process, while offset and noise are not degraded. The proposed <inline-formula> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula>/p-well implantation trench is a good solution to enhance the sensitivity of a low-voltage CMOS VHD with a low manufacturing cost.
topic Vertical hall device
magnetic sensitivity
trench
standard CMOS 14 technology
url https://ieeexplore.ieee.org/document/9534868/
work_keys_str_mv AT haiyunhuang sensitivityimprovementofafullysymmetricverticalhalldevicefabricatedin018x03bcmlowvoltagecmostechnology
AT yuexu sensitivityimprovementofafullysymmetricverticalhalldevicefabricatedin018x03bcmlowvoltagecmostechnology
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