The Role of Electric Pressure/Stress Suppressing Pinhole Defect on Coalescence Dynamics of Electrified Droplet

The dimple occurs by sudden pressure inversion at the droplet’s bottom interface when a droplet collides with the same liquid-phase or different solid-phase. The air film entrapped inside the dimple is a critical factor affecting the sequential dynamics after coalescence and causing defects like the...

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Bibliographic Details
Main Authors: Jaehyun Lee, Ehsan Esmaili, Giho Kang, Baekhoon Seong, Hosung Kang, Jihoon Kim, Sunghwan Jung, Hyunggun Kim, Doyoung Byun
Format: Article
Language:English
Published: MDPI AG 2021-04-01
Series:Coatings
Subjects:
Online Access:https://www.mdpi.com/2079-6412/11/5/503