The Role of Electric Pressure/Stress Suppressing Pinhole Defect on Coalescence Dynamics of Electrified Droplet
The dimple occurs by sudden pressure inversion at the droplet’s bottom interface when a droplet collides with the same liquid-phase or different solid-phase. The air film entrapped inside the dimple is a critical factor affecting the sequential dynamics after coalescence and causing defects like the...
Main Authors: | , , , , , , , , |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-04-01
|
Series: | Coatings |
Subjects: | |
Online Access: | https://www.mdpi.com/2079-6412/11/5/503 |