Direct Ultrasonic Soldering of AlN Ceramics with Copper Substrate Using Zn–Al–Mg Solder

Direct Ultrasonic Soldering of AlN Ceramics with Copper Substrate Using Zn–Al–Mg Solder

This research aims to develop the direct soldering of aluminum nitride (AlN) ceramics with a copper substrate using Zn−Al−Mg solder. The solder type, Zn5Al3Mg, has a close-to eutectic composition with a melting point of 359 °C. The microstructure of Zn−Al&#...

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Bibliographic Details
Main Authors: Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Zackova, Marcel Kuruc
Format: Article
Language:English
Published: MDPI AG 2020-01-01
Series:Metals
Subjects:
ultrasonic soldering
zn solder
boundary
active elements
shear strength
Online Access:https://www.mdpi.com/2075-4701/10/2/160

Internet

https://www.mdpi.com/2075-4701/10/2/160

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