Investigations into packaging technology for membrane-based thermal flow sensors
A new packaging method to mount a membrane-based thermal flow sensor, flush with the surface, is presented. Therefore, a specific design for the housing is shown, which is also adaptable to other conditions. It has been experimentally shown that it is important to mount the sensor flush with the sur...
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Copernicus Publications
2015-02-01
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| Series: | Journal of Sensors and Sensor Systems |
| Online Access: | http://www.j-sens-sens-syst.net/4/45/2015/jsss-4-45-2015.pdf |
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doaj-e00b58fbfa104fb1ad34ea2e6a11a14b2020-11-24T23:24:29ZengCopernicus PublicationsJournal of Sensors and Sensor Systems2194-87712194-878X2015-02-0141455210.5194/jsss-4-45-2015Investigations into packaging technology for membrane-based thermal flow sensorsG. Dumstorff0E. Brauns1W. Lang2Institute of Microsensors, -actuators, and -systems (IMSAS), Microsystems Center Bremen, University of Bremen, Bremen, GermanyInstitute of Microsensors, -actuators, and -systems (IMSAS), Microsystems Center Bremen, University of Bremen, Bremen, GermanyInstitute of Microsensors, -actuators, and -systems (IMSAS), Microsystems Center Bremen, University of Bremen, Bremen, GermanyA new packaging method to mount a membrane-based thermal flow sensor, flush with the surface, is presented. Therefore, a specific design for the housing is shown, which is also adaptable to other conditions. It has been experimentally shown that it is important to mount the sensor flush with the surface. In addition, the experimental results are discussed. If a membrane-based thermal flow sensor is not mounted flush with the surface, vortices can occur (depending on velocity and fluid properties) or the reduction in the channel cross section plus a decrease in sensitivity have to be taken into account.http://www.j-sens-sens-syst.net/4/45/2015/jsss-4-45-2015.pdf |
| collection |
DOAJ |
| language |
English |
| format |
Article |
| sources |
DOAJ |
| author |
G. Dumstorff E. Brauns W. Lang |
| spellingShingle |
G. Dumstorff E. Brauns W. Lang Investigations into packaging technology for membrane-based thermal flow sensors Journal of Sensors and Sensor Systems |
| author_facet |
G. Dumstorff E. Brauns W. Lang |
| author_sort |
G. Dumstorff |
| title |
Investigations into packaging technology for membrane-based thermal flow sensors |
| title_short |
Investigations into packaging technology for membrane-based thermal flow sensors |
| title_full |
Investigations into packaging technology for membrane-based thermal flow sensors |
| title_fullStr |
Investigations into packaging technology for membrane-based thermal flow sensors |
| title_full_unstemmed |
Investigations into packaging technology for membrane-based thermal flow sensors |
| title_sort |
investigations into packaging technology for membrane-based thermal flow sensors |
| publisher |
Copernicus Publications |
| series |
Journal of Sensors and Sensor Systems |
| issn |
2194-8771 2194-878X |
| publishDate |
2015-02-01 |
| description |
A new packaging method to mount a membrane-based thermal flow sensor, flush
with the surface, is presented. Therefore, a specific design for the housing
is shown, which is also adaptable to other conditions. It has been
experimentally shown that it is important to mount the sensor flush with the
surface. In addition, the experimental results are discussed. If a
membrane-based thermal flow sensor is not mounted flush with the surface,
vortices can occur (depending on velocity and fluid properties) or the
reduction in the channel cross section plus a decrease in sensitivity have to
be taken into account. |
| url |
http://www.j-sens-sens-syst.net/4/45/2015/jsss-4-45-2015.pdf |
| work_keys_str_mv |
AT gdumstorff investigationsintopackagingtechnologyformembranebasedthermalflowsensors AT ebrauns investigationsintopackagingtechnologyformembranebasedthermalflowsensors AT wlang investigationsintopackagingtechnologyformembranebasedthermalflowsensors |
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1725560484901421056 |