Investigations into packaging technology for membrane-based thermal flow sensors
A new packaging method to mount a membrane-based thermal flow sensor, flush with the surface, is presented. Therefore, a specific design for the housing is shown, which is also adaptable to other conditions. It has been experimentally shown that it is important to mount the sensor flush with the sur...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Copernicus Publications
2015-02-01
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| Series: | Journal of Sensors and Sensor Systems |
| Online Access: | http://www.j-sens-sens-syst.net/4/45/2015/jsss-4-45-2015.pdf |