Investigations into packaging technology for membrane-based thermal flow sensors
A new packaging method to mount a membrane-based thermal flow sensor, flush with the surface, is presented. Therefore, a specific design for the housing is shown, which is also adaptable to other conditions. It has been experimentally shown that it is important to mount the sensor flush with the sur...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Copernicus Publications
2015-02-01
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| Series: | Journal of Sensors and Sensor Systems |
| Online Access: | http://www.j-sens-sens-syst.net/4/45/2015/jsss-4-45-2015.pdf |
| Summary: | A new packaging method to mount a membrane-based thermal flow sensor, flush
with the surface, is presented. Therefore, a specific design for the housing
is shown, which is also adaptable to other conditions. It has been
experimentally shown that it is important to mount the sensor flush with the
surface. In addition, the experimental results are discussed. If a
membrane-based thermal flow sensor is not mounted flush with the surface,
vortices can occur (depending on velocity and fluid properties) or the
reduction in the channel cross section plus a decrease in sensitivity have to
be taken into account. |
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| ISSN: | 2194-8771 2194-878X |