Genetic Algorithm-based thermal uniformity–aware X-filling to reduce peak temperature during testing
High temperature occurs in testing of complex System-on-Chip designs and it may become a critical concern to be carefully taken into account with continual development in Very Large Scale Integration technology. Peak temperature significantly affects the reliability and the performance of the chip....
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
SAGE Publishing
2018-09-01
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| Series: | Measurement + Control |
| Online Access: | https://doi.org/10.1177/0020294018784969 |