Interactive Q-Learning Approach for Pick-and-Place Optimization of the Die Attach Process in the Semiconductor Industry
In semiconductor back-end production, the die attach process is one of the most critical steps affecting overall productivity. Optimization of this process can be modeled as a pick-and-place problem known to be NP-hard. Typical approaches are rule-based and metaheuristic methods. The two have high o...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Hindawi Limited
2019-01-01
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| Series: | Mathematical Problems in Engineering |
| Online Access: | http://dx.doi.org/10.1155/2019/4602052 |