Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO(2) nanowires

Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO(2) nanowires

Electronic packaging materials and thermal interface materials (TIMs) are widely used in thermal management. In this study, the epoxy composites with core-shell structure SiC@SiO(2) nanowires (SiC@SiO(2) NWs) as fillers could effectively enhance the thermal conductivity of epoxy composites. The uniq...

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Bibliographic Details
Main Authors: Dianyu Shen, Mengjie Wang, Yuming Wu, Zhiduo Liu, Yong Cao, Ting Wang, Xinfeng Wu, Qingtang Shi, Kuan W.A. Chee, Wen Dai, Hua Bai, Dan Dai, Jilei Lyu, Nan Jiang, Cheng-Te Lin, Jinhong Yu
Format: Article
Language:English
Published: Wiley 2017-05-01
Series:High Voltage
Subjects:
thermal conductivity
nanowires
silicon compounds
composite materials
thermal expansion
thermal stability
electronics packaging
epoxy composites
core-shell structure
interfacial compatibility epoxy matrix
Online Access:https://digital-library.theiet.org/content/journals/10.1049/hve.2017.0041

Internet

https://digital-library.theiet.org/content/journals/10.1049/hve.2017.0041

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