Reactive Ion Etching Process of Micro Mechanical Pendulum

This paper describes the reactive ion etching (RIE) technique of micro mechanical pendulum chip. Micro mechanical pendulum chip processed by the RIE has excellent performances and surface of the chip is smoother than the chip by wet etching. Properties of chip are closely associated with the process...

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Bibliographic Details
Main Authors: Zhang Wei, Duan Xiaoyan, Qiao Jin, Yue Ping
Format: Article
Language:English
Published: EDP Sciences 2017-01-01
Series:MATEC Web of Conferences
Online Access:https://doi.org/10.1051/matecconf/20179507024