Fabrication and characterization of a piezoresistive humidity sensor with a stress-free package
A highly miniaturized piezoresistive humidity sensor has been developed. The starting point of the development was a 1 × 1 mm<sup>2</sup> piezoresistive pressure sensor chip. As sensing material, a polyimide was used that swells with increasing adsorption of water molecules. To convert t...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Copernicus Publications
2014-08-01
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| Series: | Journal of Sensors and Sensor Systems |
| Online Access: | http://www.j-sens-sens-syst.net/3/167/2014/jsss-3-167-2014.pdf |