A new joining-device for manufacturing tubular butt joints with higher curing temperatures of film adhesives

A new joining-device for manufacturing tubular butt joints with higher curing temperatures of film adhesives

Abstract For detailed stress distribution analysis of bondlines, non-linear finite element analysis (FEA) is necessary. Depending on the load case in relation to shear and tension/compression adhesives show a different behaviour of the yield point [1], which is e.g. included in the Mahnken and Schli...

Full description

Bibliographic Details
Main Authors: Martin Johannes Schollerer, Jens Kosmann, Thomas Löbel, Dirk Holzhüter, Christian Hühne
Format: Article
Language:English
Published: SpringerOpen 2017-09-01
Series:Applied Adhesion Science
Subjects:
Adhesive bonding
Tubular butt joint
Joining device
Elevated curing temperature
Biaxial testing
Online Access:http://link.springer.com/article/10.1186/s40563-017-0094-8

Internet

http://link.springer.com/article/10.1186/s40563-017-0094-8

Similar Items