Condition monitoring for solder layer degradation in multi-device system based on neural network

Condition monitoring for solder layer degradation in multi-device system based on neural network

Power semiconductor devices (chips) are usually arranged in parallel to increase the power rating of the modules for high power applications like renewable energy. In multi-device systems uneven degradation of the devices is inevitable. The uneven solder layer degradation of the parallel chips trans...

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Bibliographic Details
Main Authors: Borong Hu, Sylvia Konaklieva, Shengyou Xu, Jose Ortiz-Gonzalez, Li Ran, Chong Ng, Paul McKeever, Olayiwola Alatise
Format: Article
Language:English
Published: Wiley 2019-04-01
Series:The Journal of Engineering
Subjects:
multichip modules
reliability
failure analysis
neural nets
temperature distribution
power semiconductor devices
thermal resistance
condition monitoring
solders
multichip power modules
multidevice system
power rating
high power applications
renewable energy
multidevice systems uneven degradation
uneven solder layer degradation
parallel chips translates
higher thermal resistances
degraded chips
current sharing
power module
two-stage neural network approach
stage NN
power losses
parallel devices
health condition
condition monitoring method
different constant current values
Online Access:https://digital-library.theiet.org/content/journals/10.1049/joe.2018.8025

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https://digital-library.theiet.org/content/journals/10.1049/joe.2018.8025

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