Experimental study on the thermal response of PCM-based heat sink using structured porous material fabricated by 3D printing
Phase change material (PCM) based heat sink has the potential to be applied for the thermal management of electronic devices. Whereas, PCM suffers from a low thermal conductivity, which results in local overheating at the base of heat sink. To enhance thermal performance of heat sink, a structured p...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-04-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X21000071 |