Current and Potential Applications of Additive Manufacturing for Power Electronics
To meet the upcoming challenges of higher power density and higher efficiency for power electronics, a system level approach to the design of power electronic devices must be carried out. Higher system integration and packaging will allow for more compact designs but will also result in challenges f...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
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| Series: | IEEE Open Journal of Power Electronics |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9328307/ |