RESEARCH PROCESS PLASMA ETCHING SIO2 MEMBRANE

RESEARCH PROCESS PLASMA ETCHING SIO2 MEMBRANE

The article discusses the results of plasma chemical etching of silicon dioxide in the fluorine-containing medium in the manufacture of semiconductor devices. Delivered and processed to obtain the solution of the smoothed microrelief contact windows in SiO2 other materials. The solution of the probl...

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Bibliographic Details
Main Authors: T. A. Ismailov, P. R. Zakharova, B. A. Shangereeva, A. R. Shakhmaeva
Format: Article
Language:Russian
Published: Daghestan State Technical University 2016-07-01
Series:Vestnik Dagestanskogo Gosudarstvennogo Tehničeskogo Universiteta: Tehničeskie Nauki
Subjects:
substrate
ion-plasma treatment
plasma chemical etching
Online Access:https://vestnik.dgtu.ru/jour/article/view/56

Internet

https://vestnik.dgtu.ru/jour/article/view/56

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